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Moment of inertia of a thin rectangular plate (Axis of rotation in the center of the plate)

Mass moment of inertia measures the extent to which an object resists rotational acceleration about an axis, and is the rotational analogue to mass. Moment ... more

Bearing capacity for square foundations (Terzaghi's Theory)

In geotechnical engineering, bearing capacity is the capacity of soil to support the loads applied to the ground. The bearing capacity of soil is the ... more

Bearing capacity for circular foundations (Terzaghi's Theory)

In geotechnical engineering, bearing capacity is the capacity of soil to support the loads applied to the ground. The bearing capacity of soil is the ... more

Bearing capacity for continuous foundations (Terzaghi's Theory)

In geotechnical engineering, bearing capacity is the capacity of soil to support the loads applied to the ground. The bearing capacity of soil is the ... more

Bend Deduction - right angles

Bending is a manufacturing process that produces a V-shape, U-shape, or channel shape along a straight axis in ductile materials, most commonly sheet ... more

Area moments of inertia for a filled triangular area with respect to an axis through the centroid

The second moment of area, also known as moment of inertia of plane area, area moment of inertia, polar moment of area or second area moment, is a ... more

Relation between the inradius and exradii of a right triangle

Right triangle or right-angled triangle is a triangle in which one angle is a right angle (that is, a 90-degree angle). The incircle or inscribed circle of ... more

Critical Buckling Stress of a Column with Buckling Coefficient

Column or pillar in architecture and structural engineering is a structural element that transmits, through compression, the weight of the structure above ... more

Area of a Disc (integral)

Calculates the area of a disc of radius r or the area enclosed in a circle of radius r. Partitioning the disk into thin concentric rings, like the layers ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

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