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Radius of a Contact Area between two spheres related to the force

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Angle of deflection of an end loaded cantilever beam

In engineering, deflection is the degree to which a structural element is displaced under a load. It may refer to an angle or a distance.
The angle of ... more

Elastic modulus of a contact area between a sphere and an elastic half-space

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Griffith's criterion in Linear elastic fracture mechanics (critical stress intensity factor)

Fracture mechanics is the field of mechanics concerned with the study of the propagation of cracks in materials. It uses methods of analytical solid ... more

Force exerted by stretched or contracted material

In continuum mechanics, stress is a physical quantity that expresses the internal forces that neighbouring particles of a continuous material exert on each ... more

Angle of deflection of a uniformly loaded cantilever beam

In engineering, deflection is the degree to which a structural element is displaced under a load. It may refer to an angle or a distance.
The angle of ... more

Radius of a contact area between a sphere and an elastic half-space

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. When an elastic sphere indents an elastic ... more

Critical Buckling Stress of a Column with Buckling Coefficient

Column or pillar in architecture and structural engineering is a structural element that transmits, through compression, the weight of the structure above ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

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