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Screw Thread Engagement

Bolted joints are one of the most common elements in construction and machine design. They consist of fasteners that capture and join other parts, and are ... more

Radius of a Contact Area between two spheres related to the force

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Force aplied at a contact area between a sphere and an elastic half-space

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Force on a Contact Area between a rigid cylinder and an elastic half-space

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Moment of Inertia - I-Beam (Ideal cross section)

An I-beam, also known as H-beam, W-beam (for “wide flange”), Universal Beam (UB), Rolled Steel Joist (RSJ), or ... more

Total force on a contact area between a rigid conical indenter and an elastic half-space related to the contact radius

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Total force on a contact area between a rigid conical indenter and an elastic half-space related to the total depth

ontact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Slenderness ratio

Column or pillar in architecture and structural engineering is a structural element that transmits, through compression, the weight of the structure above ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

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