'

Search results

Found 920 matches
Screw Thread Engagement

Bolted joints are one of the most common elements in construction and machine design. They consist of fasteners that capture and join other parts, and are ... more

Force aplied at a contact area between a sphere and an elastic half-space

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Force on a Contact Area between a rigid cylinder and an elastic half-space

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Torsion constant (Ellipse -cross-sectional shape)

In solid mechanics, torsion is the twisting of an object due to an applied torque. The torsion constant is a geometrical property of a bar’s cross-section ... more

Total force on a contact area between a rigid conical indenter and an elastic half-space related to the contact radius

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Total force on a contact area between a rigid conical indenter and an elastic half-space related to the total depth

ontact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Moment of Inertia - I-Beam (Ideal cross section)

An I-beam, also known as H-beam, W-beam (for “wide flange”), Universal Beam (UB), Rolled Steel Joist (RSJ), or ... more

Elastic deflection of a uniformly loaded cantilever beam

Elastic deflection is the degree to which a structural element is displaced under a load.
The deflection, at the free end, of a cantilevered beam ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

...can't find what you're looking for?

Create a new formula