'

Search results

Found 1212 matches
Doppler Effect - for stationary observer

The Doppler effect is the change in frequency of a wave (or other periodic event) for an observer moving relative to its source. When the speeds of source ... more

Photoelectric Effect - max kinetic energy of an ejected electron

The photoelectric effect is the observation that many metals emit electrons when light shines upon them. Electrons emitted in this manner may be called ... more

Micro chevron (MC) test (critical energy release rate)

The wafer bond characterization is based on different methods and tests. Wafer bonds are commonly characterized by three important encapsulation ... more

Turnbuckle (The direct shear stress induced in screw thread)

A mechanical joint is a part of a machine which is used to connect another mechanical part or mechanism. Mechanical joints may be temporary or permanent. ... more

Rotational stiffness ( depended on rigidity modulus of the material)

Stiffness is the rigidity of an object — the extent to which it resists deformation in response to an applied force. In general, stiffness is not the same ... more

Magnetic dipole moment (Ampère model)

Far away from a magnet, its magnetic field is almost always described (to a good approximation) by a dipole field characterized by its total magnetic ... more

Magnetic field created by a current ( magnetomotive force.F=N*I)

An electromagnet is a type of magnet in which the magnetic field is produced by electric current. The magnetic field disappears when the current is turned ... more

Wind Chill - original model

Wind-chill or windchill, (popularly wind chill factor) is the perceived decrease in air temperature felt by the body on exposed skin due to the flow of ... more

Electric Potential Energy (related to Electrical Work)

Electrical work is the work done on a charged particle by an electric field. The equation for 'electrical’ work is equivalent to that of ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

...can't find what you're looking for?

Create a new formula