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Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Ball Screw - Frictional Resistance

A ball screw is a mechanical linear actuator that translates rotational motion to linear motion with little friction. A threaded shaft provides a helical ... more

Ball Screw - Tensile Compressive Load

A ball screw is a mechanical linear actuator that translates rotational motion to linear motion with little friction. A threaded shaft provides a helical ... more

Total constant power (Three-phase electric application)

In electrical engineering, three-phase electric power systems have at least three conductors carrying alternating current voltages that are offset in time ... more

Shockley diode equation (small forward bias voltages)

In electronics, a diode is a two-terminal electronic component with asymmetric conductance; it has low (ideally zero) resistance to current in one ... more

Cyclic quadrilateral (cosine of an angle)

In Euclidean geometry, a cyclic quadrilateral or inscribed quadrilateral is a quadrilateral whose vertices all lie on a single circle. This circle is ... more

Load and Resistance Factor Design (LRFD) - Load combinations (eq6a)

In structural engineering, a structure is a body or combination of pieces of rigid bodies in space to form a fitness system for supporting loads. ... more

Descartes' theorem ( externally tangent circle to three given kissing circles)

In geometry, Descartes’ theorem states that for every four kissing, or mutually tangent, circles, the radii of the circles satisfy a certain ... more

Descartes' theorem ( internally tangent circle to three given kissing circles)

n geometry, Descartes’ theorem states that for every four kissing, or mutually tangent, circles, the radii of the circles satisfy a certain quadratic ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

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