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Found 1656 matches
Capillary Action - height of the meniscus

Capillary action (sometimes capillarity, capillary motion, or wicking) is the ability of a liquid to flow in narrow spaces without the assistance of, and ... more

Optimum pyramidal horn antenna - H-field

A horn antenna or microwave horn is an antenna that consists of a flaring metal waveguide shaped like a horn to direct radio waves in a beam. Horns are ... more

Optimum pyramidal horn antenna - E-field

A horn antenna or microwave horn is an antenna that consists of a flaring metal waveguide shaped like a horn to direct radio waves in a beam. Horns are ... more

Optimum conical horn antenna

A horn antenna or microwave horn is an antenna that consists of a flaring metal waveguide shaped like a horn to direct radio waves in a beam. Horns are ... more

Klein bagel (4-D non-intersecting parameterization y- coordinate)

n mathematics, the Klein bottle is an example of a non-orientable surface, informally, it is a surface (a two-dimensional manifold) in which notions of ... more

Apparent power

The power factor of an AC electrical power system is defined as the ratio of the real power flowing to the load, to the apparent power in the circuit. In a ... more

Cyclic quadrilateral (Length of the diagonal opposite angle B)

In Euclidean geometry, a cyclic quadrilateral or inscribed quadrilateral is a quadrilateral whose vertices all lie on a single circle. This circle is ... more

Miller indices calculator ( planar spacing distance in bcc system)

Miller indices form a notation system in crystallography for planes in crystal (Bravais) lattices.
In particular, a family of lattice planes is ... more

Elastic deflection at any point along the span of a center loaded beam

Elastic deflection is the degree to which a structural element is displaced under a load.
The deflection at any point, along the span of a center ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

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