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Stress is a physical quantity that expresses the internal forces that neighboring particles of a continuous material exert on each other. Any strain ... more

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

Elastic deflection is the degree to which a structural element is displaced under a load.
The deflection at any point, along the span of a center ... more

Contact mechanics is the study of the deformation of solids that touch each other at one or more points.When two solid surfaces are brought into close ... more

In engineering, deflection is the degree to which a structural element is displaced under a load.
The maximum elastic deflection on a beam supported ... more

The wafer bond characterization is based on different methods and tests. Wafer bonds are commonly characterized by three important encapsulation ... more

The speed of sound is the distance travelled per unit of time by a sound wave propagating through an elastic medium.
The speed of sound for ... more

In solid mechanics, in the field of rotordynamics, the critical speed is the theoretical angular velocity that excites the natural frequency of a rotating ... more

Elastic deflection is the degree to which a structural element is displaced under a load.
The deflection, at the free end, of a cantilevered beam ... more