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Euler's line Equation (any triangle)

In geometry, the Euler line is a line determined from any triangle that is not equilateral. It passes through several important points determined from the ... more

R-value (insulation) of a multi-layered installation - U.S. units

The R-value is a measure of thermal resistance, or ability of heat to transfer from hot to cold, through materials (such as insulation) and assemblies of ... more

R-value (insulation)

In building and construction,the R-value is a measure of how well an object, per unit of its exposed area, resists conductive flow of heat: the greater the ... more

Specific absorption rate (SAR)

Specific absorption rate calculates the rate at which energy is absorbed by the body when exposed to a radio frequency (RF) electromagnetic field. Specific ... more

Klein bagel (4-D non-intersecting parameterization y- coordinate)

n mathematics, the Klein bottle is an example of a non-orientable surface, informally, it is a surface (a two-dimensional manifold) in which notions of ... more

Descartes' theorem ( externally tangent circle to three given kissing circles)

In geometry, Descartes’ theorem states that for every four kissing, or mutually tangent, circles, the radii of the circles satisfy a certain ... more

Descartes' theorem ( internally tangent circle to three given kissing circles)

n geometry, Descartes’ theorem states that for every four kissing, or mutually tangent, circles, the radii of the circles satisfy a certain quadratic ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

Klein bagel (4-D non-intersecting parameterization x- coordinate)

n mathematics, the Klein bottle is an example of a non-orientable surface, informally, it is a surface (a two-dimensional manifold) in which notions of ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

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