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Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

Number density is an intensive quantity used to describe the degree of concentration of countable objects. For atoms or molecules of a well-defined ... more

The modulus of elasticity of concrete is a function of the modulus of elasticity of the aggregates and the cement matrix and their relative proportions. ... more

Resilience is the ability of a material to absorb energy when it is deformed elastically, and release that energy upon unloading. Proof resilience is ... more

Hydrostatic weighing, also referred to as “underwater weighing,” “hydrostatic body composition analysis,” and ... more

A cantilever is a beam anchored at only one end. The beam carries the load to the support where it is forced against by a moment and shear stress. A ... more

A supersonic expansion fan, technically known as Prandtl–Meyer expansion fan, is a centred expansion process that occurs when a supersonic flow turns ... more

A supersonic expansion fan, technically known as Prandtl–Meyer expansion fan, is a centred expansion process that occurs when a supersonic flow turns ... more

The Diesel cycle is a combustion process of a reciprocating internal combustion engine. In it, fuel is ignited by heat generated by compressing air in the ... more