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Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

Number density is an intensive quantity used to describe the degree of concentration of countable objects. For atoms or molecules of a well-defined ... more

The modulus of elasticity of concrete is a function of the modulus of elasticity of the aggregates and the cement matrix and their relative proportions. ... more

Resilience is the ability of a material to absorb energy when it is deformed elastically, and release that energy upon unloading. Proof resilience is ... more

In electrochemistry, the Nernst equation is an equation that relates the reduction potential of an electrochemical reaction (half-cell or full cell ... more

Hydrostatic weighing, also referred to as “underwater weighing,” “hydrostatic body composition analysis,” and ... more

A cantilever is a beam anchored at only one end. The beam carries the load to the support where it is forced against by a moment and shear stress. A ... more

Chladni’s law, named after Ernst Chladni, relates the frequency of modes of vibration for flat circular surfaces with fixed center as a function of ... more

In fluid flow, friction loss (or skin friction) is the loss of pressure or “head” that occurs in pipe or duct flow due to the effect of the fluid’s ... more