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Horizontal Forces at the wheels for a bicycle (front wheel)

Though longitudinally stable when stationary, a bike may become longitudinally unstable under sufficient acceleration or deceleration. The horizontal ... more

Horizontal Forces at the wheels for a bicycle (rear wheel)

Though longitudinally stable when stationary, a bike may become longitudinally unstable under sufficient acceleration or deceleration. The horizontal ... more

Curvature of a Bimetallic Beam

A bimetallic strip is used to convert a temperature change into mechanical displacement. The strip consists of two strips of different metals which expand ... more

Maximum axial load that a long, slender, ideal column can carry without buckling

Column or pillar in architecture and structural engineering is a structural element that transmits, through compression, the weight of the structure above ... more

Griffith's criterion in Linear elastic fracture mechanics (critical stress intensity factor)

Fracture mechanics is the field of mechanics concerned with the study of the propagation of cracks in materials. It uses methods of analytical solid ... more

Critical Buckling Stress of a Column with Buckling Coefficient

Column or pillar in architecture and structural engineering is a structural element that transmits, through compression, the weight of the structure above ... more

Self-buckling critical height ( for a free-standing, vertical column)

Column or pillar in architecture and structural engineering is a structural element that transmits, through compression, the weight of the structure above ... more

Compound lens' focal length

A lens is a transmissive optical device which affects the focusing of a light beam through refraction. A simple lens consists of a single piece of ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

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