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The wafer bond characterization is based on different methods and tests. Wafer bonds are commonly characterized by three important encapsulation ... more
Contact mechanics is the study of the deformation of solids that touch each other at one or more points. The Derjaguin-Muller-Toporov (... more
Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more
Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more
Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more
A bimetallic strip is used to convert a temperature change into mechanical displacement. The strip consists of two strips of different metals which expand ... more
In solid mechanics, in the field of rotordynamics, the critical speed is the theoretical angular velocity that excites the natural frequency of a rotating ... more
For homogeneous isotropic materials simple relations exist between elastic constants (Young’s modulus E, bulk modulus K, and Poisson’s ratio ν) ... more
In materials science, shear modulus or modulus of rigidity, denoted by G, or sometimes S or μ, is defined as the ratio of shear stress to the shear strain. ... more
Column or pillar in architecture and structural engineering is a structural element that transmits, through compression, the weight of the structure above ... more
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