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Angle of deflection of an end loaded cantilever beam

In engineering, deflection is the degree to which a structural element is displaced under a load. It may refer to an angle or a distance.
The angle of ... more

Angle of deflection of a uniformly loaded cantilever beam

In engineering, deflection is the degree to which a structural element is displaced under a load. It may refer to an angle or a distance.
The angle of ... more

Αxial stiffness for an element in tension

The stiffness of a body is a measure of the resistance offered by an elastic body to deformation.
Tension describes the pulling force exerted by each ... more

Self-buckling critical height ( for a free-standing, vertical column)

Column or pillar in architecture and structural engineering is a structural element that transmits, through compression, the weight of the structure above ... more

Rotational stiffness ( depended on rigidity modulus of the material)

Stiffness is the rigidity of an object — the extent to which it resists deformation in response to an applied force. In general, stiffness is not the same ... more

Modulus of resilience

Resilience is the ability of a material to absorb energy when it is deformed elastically, and release that energy upon unloading. Proof resilience is ... more

Cantilever Euler Beam - Maximum Displacement

Euler–Bernoulli beam theory (also known as engineer’s beam theory or classical beam theory) is a simplification of the linear theory of elasticity ... more

Cantilever Euler Beam - Displacement

Euler–Bernoulli beam theory (also known as engineer’s beam theory or classical beam theory) is a simplification of the linear theory of elasticity ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

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