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Micro chevron (MC) test (critical energy release rate)

The wafer bond characterization is based on different methods and tests. Wafer bonds are commonly characterized by three important encapsulation ... more

Profit percentage

Profit percentage is the percentage of cost price that one gets as profit on top of cost price. Profit percentage is calculated with cost price taken as ... more

Arithmetic Mean Return

Compound annual growth rate is a business and investing specific term for the geometric progression ratio that provides a constant rate of return over the ... more

Compound annual growth rate

Compound annual growth rate is a business and investing specific term for the geometric progression ratio that provides a constant rate of return over the ... more

Auger electron spectroscopy - Total yield

Auger electron spectroscopy is a common analytical technique used specifically in the study of surfaces and, more generally, in the area of materials ... more

Tensile force for undercut threaded rod

A threaded rod, also known as a stud, is a relatively long rod that is threaded on both ends; the thread may extend along the complete length of the ... more

Auger electron spectroscopy - The Auger yield

Auger electron spectroscopy is a common analytical technique used specifically in the study of surfaces and, more generally, in the area of materials ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

Auger electron spectroscopy - The Auger yield (relative to the transition probability)

Auger electron spectroscopy is a common analytical technique used specifically in the study of surfaces and, more generally, in the area of materials ... more

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