Search results

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

Fracture mechanics is the field of mechanics concerned with the study of the propagation of cracks in materials. It uses methods of analytical solid ... more

Stiffness is the rigidity of an object — the extent to which it resists deformation in response to an applied force. In general, stiffness is not the same ... more

Shear stress, is defined as the component of stress coplanar with a material cross section. Shear stress arises from the force vector component parallel to ... more

Hooke’s law is a principle of physics that states that the force F needed to extend or compress a spring by some distance X is proportional to that ... more

A fracture is the separation of an object or material into two, or more, pieces under the action of stress.There are three ways of applying a force to ... more

A type of elastic wave, the S-wave, secondary wave, or shear wave (sometimes called an elastic S-wave) is one of the two main types of elastic body waves, ... more

A fracture is the separation of an object or material into two, or more, pieces under the action of stress.There are three ways of applying a force to ... more

Seismic moment is a quantity to measure the size of an earthquake and is proportional to the area of the rupture times the average slip that took place ... more